Wafer Dicing and Cutting Cleaning Agent 2019 F

Suitable for cutting cleaning and oxidation resistance of various wafers, LEDs, silicon chips, and ceramic substrates.

Protects Semiconductors: Quickly removes silicon dust generated during cutting, reducing the risk of scratches on semiconductor surfaces.
Anti-Oxidation, Non-Corrosive: Neutral liquid with excellent anti-oxidation properties, safe for semiconductor materials, preventing yellowing or darkening of gold-plated wafer surfaces.
Improves Yield: Minimizes edge chipping, warping, and scratching, significantly enhancing product yield.
Efficient Cleaning: Synthesized with high-quality lubricants and surfactants, providing excellent cooling, lubrication, and cleaning properties.
Protects Cutting Equipment: Extends the lifespan of cutting blades and increases processing efficiency.
Good Adhesion Properties: Effectively reduces water surface tension, increases conductivity, and prevents silicon dust adhesion.
Environmentally Friendly: Free from toxic materials, biodegradable, non-hazardous, and easy to dispose of, ensuring mild and environmentally safe handling.

Feature

Model	2019F	Appearance	Transparent liquid
Odor	Non-Irritating Odor	PH	Neutral
Pour Point	-5℃	Storage	Store in a cool, dry place indoors. Keep away from open flames, direct sunlight and rain
Shelf Life	2 Year	Packaging	1 gallon per container，25 KG per Barrel

Usage

Wear safety goggles and rubber gloves.
Dilution: Dilute the concentrate with water at a ratio of 3-4 times.
Prepare working solution: Mix the diluted liquid at a ratio of 1: 1000 to create the working solution, and circulate it in the equipment's trough.

FAQ

What is Wafer Dicing and Cutting Cleaning Agent 2019 F used for?

Wafer Dicing and Cutting Cleaning Agent 2019 F is mainly used for cutting cleaning and oxidation resistance of various wafers, LEDs, silicon chips, and ceramic substrates. Effectively removes impurities and contaminants from the cutting process, ensuring a clean surface and extending product lifespan. Suitable for cutting cleaning and oxidation resistance of various wafers, LEDs, silicon chips, and ceramic substrates.

Is Wafer Dicing and Cutting Cleaning Agent 2019 F water-based or oil-based?

The exact formulation can be confirmed further based on application and technical documentation.

What are the main benefits of Wafer Dicing and Cutting Cleaning Agent 2019 F?

Protects Semiconductors: Quickly removes silicon dust generated during cutting, reducing the risk of scratches on semiconductor surfaces.

How do you use Wafer Dicing and Cutting Cleaning Agent 2019 F?

Wear safety goggles and rubber gloves. Dilution: Dilute the concentrate with water at a ratio of 3-4 times. Prepare working solution: Mix the diluted liquid at a ratio of 1: 1000 to create the working solution, and circulate it in the equipment's trough.

What are the packaging, storage, and shelf-life details for Wafer Dicing and Cutting Cleaning Agent 2019 F?

Packaging: 1 gallon per container，25 KG per Barrel. Storage: Store in a cool, dry place indoors. Keep away from open flames, direct sunlight and rain. Shelf life: 2 Year

Can I request samples or application advice for Wafer Dicing and Cutting Cleaning Agent 2019 F?

Yes. We can support sample testing and product selection advice for Wafer Dicing and Cutting Cleaning Agent 2019 F based on your process, mold, substrate, residue type, or target surface result.

How can I get a quote for Wafer Dicing and Cutting Cleaning Agent 2019 F?

Wafer Dicing and Cutting Cleaning Agent 2019 F supports sample orders, repeat purchasing, and ongoing supply needs. Share your quantity, application, and destination, and we can help with quotation guidance.

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