Suitable for cleaning fine particles adhered to the metal surface after polishing or grinding silicon wafers, semiconductors, and optical glass materials.
| Model | 1015B | Appearance | Transparent light yellow liquid. |
|---|---|---|---|
| Odor | Non-Irritating Odor | PH | 12 |
| Pour Point | 2℃ | Storage | Store in a cool, dry place indoors. Keep away from open flames, direct sunlight and rain |
| Shelf Life | 2 Year | Packaging | 25 KG per Barrel |
Wafer Grinding Cleaning Agent-1015 B is mainly used for cleaning fine particles adhered to the metal surface after polishing or grinding silicon wafers, semiconductors, and optical glass materials. Suitable for cleaning fine particles adhered to the metal surface after polishing or grinding silicon wafers, semiconductors, and optical glass materials.
The exact formulation can be confirmed further based on application and technical documentation.
High Efficiency Cleaning: Powerful cleaning capability effectively removes oil, fine particles, fingerprints, and other contaminants while forming a protective layer.
Ultrasonic Cleaning:. Wear Safety Gear: Put on protective goggles and rubber gloves. Dilute with Water: Dilute up to 10-30 times with water; heating to 40-70°C enhances effectiveness.
Packaging: 25 KG per Barrel. Storage: Store in a cool, dry place indoors. Keep away from open flames, direct sunlight and rain. Shelf life: 2 Year
Yes. We can support sample testing and product selection advice for Wafer Grinding Cleaning Agent-1015 B based on your process, mold, substrate, residue type, or target surface result.
Wafer Grinding Cleaning Agent-1015 B supports sample orders, repeat purchasing, and ongoing supply needs. Share your quantity, application, and destination, and we can help with quotation guidance.
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