Wafer Laser Cutting Protection Fluid-2086

Suitable for industries such as semiconductors, automotive, aerospace, electronics, lithium batteries, solar panel components, non-ferrous metal fibers, and precision machinery.

Outstanding Performance: Specifically designed for laser cutting processes, offering excellent heat dissipation and lubrication, enhancing cutting quality and precision for smooth, clean semiconductor surfaces.
Protects Semiconductors: No scratching on wafer surfaces.
Excellent Heat Dissipation and Cooling Functionality: Provides effective thermal management during cutting.
Material Savings: Reduces heat-affected zones and narrow cutting gaps, conserving materials.
Protects Equipment: Prevents damage to laser equipment lenses during cutting.
User-Friendly: Safe for both human health and the environment.

Feature

Model	2086	Appearance	Transparent liquid
Odor	Non-Irritating Odor	PH	Neutral
Storage	Store in a cool, dry place indoors. Keep away from open flames, direct sunlight and rain	Shelf Life	2 Year
Packaging	1 gallon per container，25 KG per Barrel

Usage

Wear protective goggles and rubber gloves.
Evenly apply the product by spraying or brushing onto the surface of the semiconductor.
Proceed with laser cutting of the semiconductor.

FAQ

What is Wafer Laser Cutting Protection Fluid-2086 used for?

Wafer Laser Cutting Protection Fluid-2086 is mainly used for industries such as semiconductors, automotive, aerospace, electronics, lithium batteries, solar panel components, non-ferrous metal fibers, and precision machinery. Suitable for industries such as semiconductors, automotive, aerospace, electronics, lithium batteries, solar panel components, non-ferrous metal fibers, and precision machinery.

Is Wafer Laser Cutting Protection Fluid-2086 water-based or oil-based?

The exact formulation can be confirmed further based on application and technical documentation.

What are the main benefits of Wafer Laser Cutting Protection Fluid-2086?

Outstanding Performance: Specifically designed for laser cutting processes, offering excellent heat dissipation and lubrication, enhancing cutting quality and precision for smooth, clean semiconductor surfaces.

How do you use Wafer Laser Cutting Protection Fluid-2086?

Wear protective goggles and rubber gloves. Evenly apply the product by spraying or brushing onto the surface of the semiconductor. Proceed with laser cutting of the semiconductor.

What are the packaging, storage, and shelf-life details for Wafer Laser Cutting Protection Fluid-2086?

Packaging: 1 gallon per container，25 KG per Barrel. Storage: Store in a cool, dry place indoors. Keep away from open flames, direct sunlight and rain. Shelf life: 2 Year

Can I request samples or application advice for Wafer Laser Cutting Protection Fluid-2086?

Yes. We can support sample testing and product selection advice for Wafer Laser Cutting Protection Fluid-2086 based on your process, mold, substrate, residue type, or target surface result.

How can I get a quote for Wafer Laser Cutting Protection Fluid-2086?

Wafer Laser Cutting Protection Fluid-2086 supports sample orders, repeat purchasing, and ongoing supply needs. Share your quantity, application, and destination, and we can help with quotation guidance.

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